| 摘要: |
| 利用电化学阻抗谱(EIS)对紫铜和铜镍合金在静止、洁净海水中表面成膜的过程进行了监测,根据不同阶段的EIS特征建立不同等效电路模型进行拟合分析,获得了铜合金基体及其表面膜层对应的界面电化学信息参数,通过比较3种金属(B10,TUP,B30)表面膜层随时间变化的差异,探讨了合金成分对表面成膜过程的影响。结果表明,浸泡前期B10和TUP的耐蚀性较差,但随着海水中浸泡时间增加,三者的耐蚀能力逐渐接近。TUP的EIS显示了其表面内、外膜层信息,B10表面膜层的成长速度和稳定性均不如B30,反映出合金中镍含量的增多,增加了铜镍合金表面成膜产生钝化的效应。 |
| 关键词: 电化学阻抗谱(EIS) 铜镍合金 海水 表面膜 |
| DOI： |
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| 基金项目:国家“十·五”重点资助项目(CZB1.1-1) |
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| EIS characteristics of Cu-based alloy in seawater |
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| Abstract: |
| Film-forming behavior of copper alloy in clean and static seawater was monitored using EIS method. According to the EIS characteristics of different immersion durations, corresponding equivalent circuits were developed, and the electrochemical parameters of the corrosion system were obtained. Variations in surface film of different copper alloys were compared to discuss the effect of alloy elements on film-forming. The results showed that both B10 and TUP do not have a good performance of anti-corrosion in early stage of immersion. However, their corrosion resistance would be close to that of B30 with increasing immersion time in seawater. The EIS of TUP revealed the information of inner and outer layers of the film, and B10 does not has the same performance on growth and stability of surface film as B30 does, which indicated that the increase of nickel is beneficial to the passivation tendency of Cu-Ni alloys. |
| Key words: EIS TUP Cu-Ni-Alloy seawater surface film |
